Industries · PCB & FPCB
PCB & FPCB Manufacturing
Copper plating, via filling and final finishes for rigid, flex and HDI circuit boards.
Overview
Circuit board fabrication depends on chemistry that holds its window across thousands of panels. Our PCB portfolio covers the full process chain — from cleaning and micro-etching through copper plating to final finishes — with analytical control methods for each bath.
- Acid copper for through-hole and via filling, DC and pulse systems
- Horizontal and vertical plating lines, including roll-to-roll
- Final finishes: ENIG / ENEPIG, immersion silver and immersion tin
- Analytical control packages for bath maintenance
Related Process Families
Chemistry from our portfolio that supports this industry.
Copper Plating
Acid copper systems for PTH and via filling in HDI, 5G substrates and multilayer boards.
Surface Finishes
ENIG / ENEPIG, immersion silver and tin final finishes with stable solderability.
Surface Treatment Technology
Cleaning, etching and micro-etching for consistent adhesion and fine-line definition.
Discuss Your Application
Send us your substrate, line type and performance targets — we will recommend the right process and share comparable case data.