Copper Plating

Pulse and DC acid copper processes for through-hole filling, blind via filling and roll-to-roll plating.

8 products in Copper Plating

Cu-56 / CU-560 / CU-56HF Water-Soluble Copper Surface Protectant Oxidation Barrier: Water-reducible liquid concentrates engineered to prevent discoloration and oxidation on electroless and electroplated copper… View Product →

MC-1200 Pulse Copper Plating Process Fine-grained, high-ductility copper deposit with excellent thickness uniformity. View Product →

NC Series Cyanide-Free Alkaline Copper Plating Process Cyanide-free alkaline copper process providing excellent coverage and adhesion as a strike or plate layer. View Product →

SG-100 Pulse Copper Plating Process for TGV Applications Excellent filling capability for both Through-Holes (TH) and Blind Vias (BVH). View Product →

SG-300 Insoluble-Anode Pulse Copper Plating for High-Aspect-Ratio Applications Insoluble-anode pulse plating system engineered for high-aspect-ratio through-holes and advanced packaging. View Product →

TC-200 Acid Copper Plating Additive Superior copper thickness and uniform distribution even at high current densities(CD). View Product →

VF-201 Blind Microvia Filling Additive Produces a bright deposit with an excellent fine-grained copper structure. View Product →

VP-100 Roll-to-Roll Acid Copper Plating Process Excellent ductility (25-30%) and high tensile strength (300-420 N/mm²). View Product →