Products

Pre-treatment & Cleaning ACTANE 690 Metal & Alloy Pre-treatment Activator Activation salts for pre-treating nickel alloys, steel and other metal surfaces ahead of plating. View Product →

Pre-treatment & Cleaning ACY-01 Low-Temperature Chemical Degreasing Powder Low-temperature alkaline degreasing powder that removes oils and soils prior to plating while saving energy. View Product →

Immersion Silver AG-120 Water-Soluble Silver Surface Protectant Water-soluble post-dip that protects immersion silver finishes from oxidation and tarnish. View Product →

Immersion Silver AG-600B Immersion Silver Process Produces a high-performance, dense, uniform, and anti-tarnish silver deposit. View Product →

Electroplating Silver AGTECH E100 Bright Silver Plating Additive Brightening additive for silver plating baths, delivering mirror-bright, tarnish-resistant deposits. View Product →

Electroplating Gold ALT-AUCC Acid Hard Gold Plating Process Acid hard gold process for wear-resistant contacts and connector applications. View Product →

Alloy Plating ANC Nickel-Cobalt Alloy Plating Process Nickel-cobalt alloy plating for high hardness and thermal stability in electronic and industrial components. View Product →

Electroplating Chrome ANKOR-280NF Hard Chrome Plating Additive Advanced Fluoride-Free Process: A high-speed, fluoride-free hard chrome process View Product →

Immersion Silver Argentech MSA-Based Immersion Silver Process Provides both fast and slow electroless silver plating systems, along with pre- and post-treatment solutions. View Product →

EPENIG AU-301 Electroless Gold Plating Process AU-301 produces a uniform 24k pure gold deposit on nickel surfaces. View Product →

Alloy Plating AZN-222 Alkaline Zinc-Nickel Alloy Plating Additive Stable Gamma-Phase Deposit: Delivers a high-performance Zinc-Nickel alloy layer with a consistent Nickel content of 12-15%… View Product →

Alloy Plating AZN-2430 Alkaline Zinc-Nickel Alloy Plating Additive Precision Alloy Control: A high-performance alkaline process that stabilizes Nickel content within the optimal 12-15% range,… View Product →

Alloy Plating AZN-680 Acid Zinc-Nickel Alloy Plating Additive Stable Alloy Composition: A weak-acid process that delivers a consistent Nickel content of 10-16% across the… View Product →

Etching & Micro-etching COPPER-61 Micro-etch for Copper & Copper Alloys Micro-etch chemistry for copper and copper alloys, delivering uniform, activated surfaces for downstream plating. View Product →

Electroplating Chrome CR-96 High Salt Spray Resistance Grey Chrome Additive High Corrosion Resistance: A low-temperature, high-corrosion-resistant process with a professional grey-black aesthetic finish. View Product →

Etching & Micro-etching CS-500 Alkaline Etchant Alkaline etchant for controlled removal of copper and surface conditioning in PCB processing. View Product →

Roll to Roll Plating & Leadframe CU-011 Lead Frame Surface Protector Anti-tarnish protectant that preserves leadframe copper surfaces during storage and handling. View Product →

Copper Plating Cu-56 / CU-560 / CU-56HF Water-Soluble Copper Surface Protectant Oxidation Barrier: Water-reducible liquid concentrates engineered to prevent discoloration and oxidation on electroless and electroplated copper… View Product →

Roll to Roll Plating & Leadframe DESCABASE CU Copper Alloy Activation for Leadframes Activation process for copper alloys in leadframe manufacturing and roll-to-roll plating lines. View Product →

Etching & Micro-etching DH-820 Micro-etch Stabilizer Stabilizer for micro-etching baths, ensuring controlled etch rates and consistent surface topography. View Product →

Electroplating Chrome DYNE-30 Chrome Mist Inhibitor Powerful Surface Tension Reduction: Significantly lowers the surface tension of hexavalent chrome baths to below 30… View Product →

EPENIG ENEPIG Process — Electroless Nickel / Electroless Palladium / Immersion Gold Complete ENEPIG final finish chemistry: electroless nickel, electroless palladium and immersion gold layers. View Product →

EPIG ENIG Process — Electroless Nickel / Immersion Gold ENIG final finish system combining electroless nickel with immersion gold for flat, solderable surfaces. View Product →

Post-treatment & Surface Protection HELIOS-232 Nano-Scale OSP Coating Superior Bath Stability: A water-soluble formulation ensuring exceptional bath control and stability. No by-products or precipitation… View Product →

Electroplating Silver HJ-400 Cyanide-Free Silver Plating Process Cyanide-free silver plating process combining operator safety with bright, ductile deposits. View Product →

Electronic Plating INTECH-2000 Pure Indium Electroplating Additive INTECH-2000 is a high-speed, high-efficiency, and highly stable pure indium plating additive. View Product →

Copper Plating MC-1200 Pulse Copper Plating Process Fine-grained, high-ductility copper deposit with excellent thickness uniformity. View Product →

Copper Plating NC Series Cyanide-Free Alkaline Copper Plating Process Cyanide-free alkaline copper process providing excellent coverage and adhesion as a strike or plate layer. View Product →

Electroplating Nickel NI-2006HSX Low-Stress Nickel Plating Additive Produces semi-bright nickel deposits with low internal stress and excellent View Product →

Electroless Nickel NIHP-2302 High-Phosphorus Electroless Nickel Plating Additive Stable High-Phosphorus Deposit: Produces an alloy coating with a precise Phosphorus (P) content of 10-12%, ensuring… View Product →

Electroless Nickel NILP-606 Low-Phosphorus Electroless Nickel Plating Additive Exceptional Hardness & Durability: Engineered for high-wear environments. After standard heat treatment, the deposit achieves a… View Product →

Electroless Nickel NIMP-1614 Mid-Phosphorus Electroless Nickel Plating Additive Exceptional Brightness: Delivers a brilliant, high-luster Nickel-Phosphorus alloy deposit with a consistent Phosphorus (P) content of… View Product →

Electroless Nickel NIPF-1504 Nickel-Coated Copper (Ni/Cu) Additive (Phosphorus-Free) High-temperature resistance with superior solderability and thermal bonding strength on copper. View Product →

Powder Electroless Plating Technology P-01 ACTANE 690 Oxide Removal for Metal & Alloy Powders Powder-grade activation salts for removing oxides from metal and alloy powders before coating. View Product →

Powder Electroless Plating Technology P-02 SC-2020DE Acid Cleaner for Copper Powders Powder-grade acid cleaner for copper powder surfaces, ensuring uniform activation. View Product →

Powder Electroless Plating Technology P-03 AG-600B Silver-Coated Copper Additive Additive system for silver-coating copper powders used in conductive pastes and EMI shielding. View Product →

Powder Electroless Plating Technology P-04 STAN-26 Tin-Coated Copper Process Immersion tin chemistry for coating copper powders with uniform, solderable tin layers. View Product →

Powder Electroless Plating Technology P-05 AU-602CF Cyanide-Free Gold-Coated Nickel Process Cyanide-free electroless gold process for nickel powder coating in high-reliability applications. View Product →

Powder Electroless Plating Technology P-06 NIP-1504 Nickel-Coated Graphite / Copper Powder Process Electroless nickel process for graphite and copper powders used in conductive and thermal materials. View Product →

Powder Electroless Plating Technology P-07 AU-301 Gold-Coated Nickel Process Electroless gold coating for nickel powders, delivering stable conductivity and oxidation resistance. View Product →

Powder Electroless Plating Technology P-08 CU-011 Copper Surface Protectant for Powders Powder-grade protectant preventing oxidation of copper powders during storage and processing. View Product →

Powder Electroless Plating Technology P-09 T-70RAD Ionic Contamination Cleaner for Powders Ionic contamination remover for powder surfaces, improving coating uniformity and reliability. View Product →

Alloy Plating PALLADEX PN-200 High-Speed Palladium-Nickel Plating Additive Utilizes high-speed electroplating technology specifically designed for palladium-nickel （Pd-Ni） alloy plating on electronic components. View Product →

Post-treatment & Surface Protection SC-0505K Powder Dispersant Wetting: Utilizes solvents (water, organic solvents, or surfactants) to wet the particle surface and break down… View Product →

Pre-treatment & Cleaning SC-2020DE Acid Copper Cleaner Acidic cleaner formulated for copper surfaces, removing oxidation and organic contamination before finishing. View Product →

Copper Plating SG-100 Pulse Copper Plating Process for TGV Applications Excellent filling capability for both Through-Holes (TH) and Blind Vias (BVH). View Product →

Copper Plating SG-300 Insoluble-Anode Pulse Copper Plating for High-Aspect-Ratio Applications Insoluble-anode pulse plating system engineered for high-aspect-ratio through-holes and advanced packaging. View Product →

Immersion Tin STAN Electroless Thick Tin Process Suitable for pure copper surfaces with a professional matte finish. View Product →

Immersion Tin STANAL-TS Direct Immersion Tin for Aluminum Alloys Direct immersion tin process for aluminum alloy surfaces without zincate pre-treatment. View Product →

Immersion Tin T-70RAD Ionic Cleaner for Immersion Tin & Silver T-70RPT is a water-soluble acidic concentrate designed for post-treatment after immersion tin or electro-tin plating. View Product →

Immersion Tin T-70RPT Anti-Tarnish Agent for Immersion Tin T-70RPT is a water-soluble acidic concentrate designed for post-treatment after immersion tin or electro-tin plating. View Product →

Immersion Tin T600 Immersion Tin Process High-performance additive for Methanesulfonic Acid (MSA) and Sulfuric Acid Systems. View Product →

Copper Plating TC-200 Acid Copper Plating Additive Superior copper thickness and uniform distribution even at high current densities(CD). View Product →

Electroplating Tin TC-688 Pure Tin Electroplating Additive A single-component, sulfuric acid-based additive system producing a matte pure tin finish. View Product →

Alloy Plating Tin-Nickel Alloy Plating Process Tin-nickel alloy process producing corrosion-resistant, decorative and functional deposits. View Product →

Electroplating Tin TINTECH-MSA Electro-Tin Plating Additive Exceptionally stable process; electrolyte bath can remain viable for several years. View Product →

Copper Plating VF-201 Blind Microvia Filling Additive Produces a bright deposit with an excellent fine-grained copper structure. View Product →

Copper Plating VP-100 Roll-to-Roll Acid Copper Plating Process Excellent ductility (25-30%) and high tensile strength (300-420 N/mm²). View Product →

Electroplating Chrome XM-2000 Wear-Resistant Composite Chrome Additive High-Performance Composite: A low-temperature composite plating process with a professional matte grey aesthetic finish. View Product →

Electroplating Chrome XM-6000 Composite Chrome Plating Process Composite hard chrome process delivering high wear resistance for demanding industrial applications. View Product →

Post-treatment & Surface Protection ZH-558 Copper Blackening Agent Superior Anti-Reflective Performance: Specifically engineered to significantly reduce surface reflectivity on copper, enhancing optical clarity for… View Product →