Powder Electroless Plating Technology

Electroless plating chemistries engineered for powder coating — silver, tin, gold and nickel coated powders.

9 products in Powder Electroless Plating Technology

P-01 ACTANE 690 Oxide Removal for Metal & Alloy Powders Powder-grade activation salts for removing oxides from metal and alloy powders before coating. View Product →

P-02 SC-2020DE Acid Cleaner for Copper Powders Powder-grade acid cleaner for copper powder surfaces, ensuring uniform activation. View Product →

P-03 AG-600B Silver-Coated Copper Additive Additive system for silver-coating copper powders used in conductive pastes and EMI shielding. View Product →

P-04 STAN-26 Tin-Coated Copper Process Immersion tin chemistry for coating copper powders with uniform, solderable tin layers. View Product →

P-05 AU-602CF Cyanide-Free Gold-Coated Nickel Process Cyanide-free electroless gold process for nickel powder coating in high-reliability applications. View Product →

P-06 NIP-1504 Nickel-Coated Graphite / Copper Powder Process Electroless nickel process for graphite and copper powders used in conductive and thermal materials. View Product →

P-07 AU-301 Gold-Coated Nickel Process Electroless gold coating for nickel powders, delivering stable conductivity and oxidation resistance. View Product →

P-08 CU-011 Copper Surface Protectant for Powders Powder-grade protectant preventing oxidation of copper powders during storage and processing. View Product →

P-09 T-70RAD Ionic Contamination Cleaner for Powders Ionic contamination remover for powder surfaces, improving coating uniformity and reliability. View Product →