Electronic Plating
Electrolytic tin, nickel, gold and silver processes for connectors, leadframes and electronic components.
7 products in Electronic Plating
Electroplating Silver AGTECH E100 Bright Silver Plating Additive
Brightening additive for silver plating baths, delivering mirror-bright, tarnish-resistant deposits.
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Electroplating Gold ALT-AUCC Acid Hard Gold Plating Process
Acid hard gold process for wear-resistant contacts and connector applications.
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Electroplating Silver HJ-400 Cyanide-Free Silver Plating Process
Cyanide-free silver plating process combining operator safety with bright, ductile deposits.
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INTECH-2000 Pure Indium Electroplating Additive
INTECH-2000 is a high-speed, high-efficiency, and highly stable pure indium plating additive.
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Electroplating Nickel NI-2006HSX Low-Stress Nickel Plating Additive
Produces semi-bright nickel deposits with low internal stress and excellent
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Electroplating Tin TC-688 Pure Tin Electroplating Additive
A single-component, sulfuric acid-based additive system producing a matte pure tin finish.
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Electroplating Tin TINTECH-MSA Electro-Tin Plating Additive
Exceptionally stable process; electrolyte bath can remain viable for several years.
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