Surface Finishing & Plating Chemistry since 2010

Surface Finishes

Immersion silver, immersion tin, ENIG / ENEPIG and electroless nickel final finishes for PCB and interconnects.

Electroless Nickel (4) EPENIG (2) EPIG (1) Immersion Silver (3) Immersion Tin (5)

15 products in Surface Finishes

Immersion Silver AG-120 Water-Soluble Silver Surface Protectant Water-soluble post-dip that protects immersion silver finishes from oxidation and tarnish. View Product →
Immersion Silver AG-600B Immersion Silver Process Produces a high-performance, dense, uniform, and anti-tarnish silver deposit. View Product →
Immersion Silver Argentech MSA-Based Immersion Silver Process Provides both fast and slow electroless silver plating systems, along with pre- and post-treatment solutions. View Product →
EPENIG AU-301 Electroless Gold Plating Process AU-301 produces a uniform 24k pure gold deposit on nickel surfaces. View Product →
EPENIG ENEPIG Process — Electroless Nickel / Electroless Palladium / Immersion Gold Complete ENEPIG final finish chemistry: electroless nickel, electroless palladium and immersion gold layers. View Product →
EPIG ENIG Process — Electroless Nickel / Immersion Gold ENIG final finish system combining electroless nickel with immersion gold for flat, solderable surfaces. View Product →
Electroless Nickel NIHP-2302 High-Phosphorus Electroless Nickel Plating Additive Stable High-Phosphorus Deposit: Produces an alloy coating with a precise Phosphorus (P) content of 10-12%, ensuring… View Product →
Electroless Nickel NILP-606 Low-Phosphorus Electroless Nickel Plating Additive Exceptional Hardness & Durability: Engineered for high-wear environments. After standard heat treatment, the deposit achieves a… View Product →
Electroless Nickel NIMP-1614 Mid-Phosphorus Electroless Nickel Plating Additive Exceptional Brightness: Delivers a brilliant, high-luster Nickel-Phosphorus alloy deposit with a consistent Phosphorus (P) content of… View Product →
Electroless Nickel NIPF-1504 Nickel-Coated Copper (Ni/Cu) Additive (Phosphorus-Free) High-temperature resistance with superior solderability and thermal bonding strength on copper. View Product →
Immersion Tin STAN Electroless Thick Tin Process Suitable for pure copper surfaces with a professional matte finish. View Product →
Immersion Tin STANAL-TS Direct Immersion Tin for Aluminum Alloys Direct immersion tin process for aluminum alloy surfaces without zincate pre-treatment. View Product →
Immersion Tin T-70RAD Ionic Cleaner for Immersion Tin & Silver T-70RPT is a water-soluble acidic concentrate designed for post-treatment after immersion tin or electro-tin plating. View Product →
Immersion Tin T-70RPT Anti-Tarnish Agent for Immersion Tin T-70RPT is a water-soluble acidic concentrate designed for post-treatment after immersion tin or electro-tin plating. View Product →
Immersion Tin T600 Immersion Tin Process High-performance additive for Methanesulfonic Acid (MSA) and Sulfuric Acid Systems. View Product →