Industries · Powder Metallurgy
Powder Electroless Plating
Coated powders — silver, tin, gold and nickel — for conductive and thermal materials.
Overview
Dry-powder electroless plating deposits a uniform metallic shell on particle surfaces without a liquid bath. The result is conductive, oxidation-resistant powder that stores easily and mixes on demand — used in conductive adhesives, EMI shielding and thermal interface materials.
- Silver, tin, gold and nickel coatings on copper, graphite and polymer powders
- Uniform shell thickness with controlled coverage
- Dry storage, no bath maintenance, mixed on demand
- Custom particle size ranges and coating loads
Related Process Families
Chemistry from our portfolio that supports this industry.
Powder Electroless Plating
Dry-powder electroless nickel and copper technology — easy storage, mixed on demand.
Electronic Plating
Silver and gold systems for high-conductivity powder coatings.
Surface Treatment Technology
Pre-treatment and post-treatment for reliable coating adhesion on particles.
Discuss Your Application
Send us your substrate, line type and performance targets — we will recommend the right process and share comparable case data.