EPENIG
AU-301 Electroless Gold Plating Process
AU-301 produces a uniform 24k pure gold deposit on nickel surfaces.
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Product Introduction
- AU-301 produces a uniform 24k pure gold deposit on nickel surfaces.
- Wide operating window with high tolerance to contamination; nickel capacity ranges from 0.5 to 1.0g/L.
- Extended bath life; maintains consistent color and brightness throughout its entireservice life.
- Heat-resistant gold layer with a fine-grained structure; provides excellent bonding, wire bonding, and solderability.
- Widely applied in electronic components, PCB, Wafer, and Semiconductor industries.
Wide parameter range
Multi-industry universal
Imported alternative
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.