Immersion Tin
STAN Electroless Thick Tin Process
Suitable for pure copper surfaces with a professional matte finish.
Need samples or technical data?
Get specifications, MSDS and pricing from our engineers.
Product Advantages
- Achievable deposit thickness of 1-6 pm.
- Suitable for pure copper surfaces with a professional matte finish.
- Fully meets modern environmental standards for lead-free surface treatments.
- Non-electrolytic process: no external power or anodes required.
- Ideal replacement for conventional electro-tin plating processes.
- Complies with all requirements for Reflow and Wave Soldering processes.
Suitable For Pure Copper Surface
Flat Alternative Electroplating Tin Process
Meets Various Process Requirements
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.
