TC-200 Acid Copper Plating Additive

Product Introduction

• Excellent Throwing Power (TP) for through-hole plating.
• Superior copper thickness and uniform distribution even at high current densities(CD).
• Excellent ductility (Elongation: 25-30%) and high tensile strength (300 – 420 N/mm²).
• High thermal shock resistance; excellent TCT and IST reliability.
• Fully compliant with all requirements for automotive PCBS.
• Simple two-component additive system; fully compatible with CVS analysis.

Excellent Through-hole Plating Capability

Uniform Thickness Distribution

High Thermal Shock Resistance and Reliability

Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.