Copper Plating

VF-201 Blind Microvia Filling Additive

Produces a bright deposit with an excellent fine-grained copper structure.

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Product Introduction

Simultaneous blind via filling and through-hole plating.
Produces a bright deposit with an excellent fine-grained copper structure.
Extended bath life / Long electrolyte longevity.
Excellent ductility and tensile strength.
Compatible with both copper balls and insoluble anodes.

High Ductility, High Tensile Strength

Applicable to Through-holes and Blind holes

Long Bath Llife

Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.