Copper Plating
VP-100 Roll-to-Roll Acid Copper Plating Process
Excellent ductility (25-30%) and high tensile strength (300-420 N/mm²).
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Product Advantages
- Excellent ductility (25-30%) and high tensile strength (300-420 N/mm²).
- Bright deposit, fine-grained structure, and extremely low internal stress.
- Maximum current density up to 50 ASD.
- Ideal for products with high current density distribution differentials.
- Compatible with Roll-to-Roll (RTR), Horizontal, and VCP production lines.
- Widely used in FPC, COF, LED strips, and PCB industries.
High Ductility, High Tensile Strength
Suitable For Large Potential Differences Between High And Low Voltage Levels
Wide Range of Applications
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.
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