Alloy Plating
PALLADEX PN-200 High-Speed Palladium-Nickel Plating Additive
Utilizes high-speed electroplating technology specifically designed for palladium-nickel （Pd-Ni） alloy plating on electronic components.
Need samples or technical data?
Get specifications, MSDS and pricing from our engineers.
Product Introduction
- Utilizes high-speed electroplating technology specifically designed for palladium-nickel （Pd-Ni） alloy plating on electronic components.
- Standard deposits contain 80 wt% Palladium, but alloy content is adjustable from 50% to 90% via process control.
- Stable deposit composition with less than +5% variation within a current density range of 50 to 800 ASF.
- Unique formulation produces bright, ductile deposits that meet stringent contact stability requirements.
- Pd-Ni alloy offers lower porosity and superior wear resistance compared to hard gold or pure palladium.
- The premier choice for high-reliability connector systems.
- •High plating rates and easy maintenance using standard technical procedures.
High-speed electroplating
Multi-industry universal
Imported alternative
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.
