NI-2006HSX Low-Stress Nickel Plating Additive

Product Introduction

• NI-2006HSX is a Nickel Sulfamate-based plating process.
• Produces semi-bright nickel deposits with low internal stress and excellent
• ductility.
• Particularly suitable as an underlayer for precious and non-precious metal plating.
• Engineered for high-speed plating equipment using both soluble and insoluble anode systems.
• Ensures exceptional crystal structure within a current density range of 5-50 ASD.
• Primarily used in the manufacturing of PCBs, connectors, semiconductors, and other high-reliability electronic components.

High current density range

Multi-industry universal

Imported alternative

Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.