TINTECH-MSA Electro-Tin Plating Additive

Product Introduction

• Exceptionally stable process; electrolyte bath can remain viable for several years.
• Reliable tin deposition performance unaffected by the age of the electrolyte bath.
• Excellent long-term solderability; survives multiple lead-free reflow assembly cycles.
• Maintains superior solderability while effectively suppressing tin whiskers.
• Alternative processes are available to resolve potential solder mask compatibility issues.

The plating solution is reliable over the long term

Multi-industry universal

Imported alternative

Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.