Immersion Silver
AG-600B Immersion Silver Process
Produces a high-performance, dense, uniform, and anti-tarnish silver deposit.
Need samples or technical data?
Get specifications, MSDS and pricing from our engineers.
Product Introduction
- Produces a high-performance, dense, uniform, and anti-tarnish silver deposit.
- Achieves 0.2-0.7 wm silver thickness within 1-3 minutes.
- Low contact resistance and high long-term reliability.
- superior solderability and wire bonding performance.
- Ideal for complex circuit layouts and designs.
- Applicable for Ceramic Substrates, PCB, Powder Coating, 3D-MID, and Photovoltaic industries.
The Plating is Dense and Smooth
The Plating Solution is Reliable Over The Long Term
Multi-industry Application
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.
