Post-treatment & Surface Protection
HELIOS-232 Nano-Scale OSP Coating
Superior Bath Stability: A water-soluble formulation ensuring exceptional bath control and stability. No by-products or precipitation occur even during temperature fluctuations.
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Core Advantages
- Superior Bath Stability: A water-soluble formulation ensuring exceptional bath control and stability. No by-products or precipitation occur even during temperature fluctuations.
- High-Performance Copper Protection: Engineered for the advanced protection of pure copper and copper alloy surfaces.
- Ultra-Thin Robust Shield: Forms a dense and robust nano-scale organic protective film that maintains surface planarity and prevents oxidation.
- Extreme Thermal Resistance: Successfully withstands up to 3 consecutive Lead-Free Reflow cycles and multiple Wave Soldering processes.
- Synergistic Performance: Optimized for use in conjunction with SC-2020 Cleaner to achieve the ultimate nano-coating integrity and adhesion.
- Precision Process Control: All chemical components are fully analyzable and controllable, ensuring repeatable high-yield production.
- Flexible Equipment Compatibility: Suitable for both immersion （dip） tanks and high-speed horizontal conveyorized systems.
Copper plating applicable
The plating solution has good stability
Imported Alternative
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.
