MC-1200 Pulse Copper Plating Process

Product Introduction

• Fine-grained, high-ductility copper deposit with excellent thickness uniformity.
• Ideal for High Aspect Ratio (HAR) of 24:1 or greater; Throwing Power (TP) reaches 95%.
• Ductility and tensile strength fully comply with industry standards for PCB and ceramic substrates.
• Superior performance in both Blind Via Filling (BVH) and Through-Hole (TH) plating.
• Resolves thickness uniformity issues inherent in DC plating; significantly reduces copper consumption.
• Suitable for AI Backplanes and high-density multi-layer HDI boards for GPUs (thickness ≥ 5mm).

Applicable Aspect Ratio > 24:1

Uniform Thickness Sistribution

Suitable for High-level HDI PCB

Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.