Powder Electroless Plating Technology
P-03 AG-600B Silver-Coated Copper Additive
Additive system for silver-coating copper powders used in conductive pastes and EMI shielding.
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Overview
Additive system for silver-coating copper powders used in conductive pastes and EMI shielding.
Part of our Powder Electroless Plating Technology portfolio. Contact our engineering team for detailed process specifications, TDS documents and sample availability.