SG-300 Insoluble-Anode Pulse Copper Plating for High-Aspect-Ratio Applications

Insoluble-anode pulse plating system engineered for high-aspect-ratio through-holes and advanced packaging.

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Overview

Insoluble-anode pulse plating system engineered for high-aspect-ratio through-holes and advanced packaging.

Part of our Copper Plating portfolio. Contact our engineering team for detailed process specifications, TDS documents and sample availability.