Powder Electroless Plating Technology
P-04 STAN-26 Tin-Coated Copper Process
Immersion tin chemistry for coating copper powders with uniform, solderable tin layers.
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Overview
Immersion tin chemistry for coating copper powders with uniform, solderable tin layers.
Part of our Powder Electroless Plating Technology portfolio. Contact our engineering team for detailed process specifications, TDS documents and sample availability.