Immersion Silver
Argentech MSA-Based Immersion Silver Process
Provides both fast and slow electroless silver plating systems, along with pre- and post-treatment solutions.
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Product Introduction
- Provides both fast and slow electroless silver plating systems, along with pre- and post-treatment solutions.
- It deposits high-performance, dense, and flat silver plating with good soldering capabilities and long-term reliability.
- It deposits a 0.2-0.7 μm silver layer on 1.5*1.5 mm pads within 1-3 minutes.
- It has strong lead-free soldering strength and is easy to assemble.
- It can completely replace expensive electroless silver plating solutions from foreign companies and is applicable to ceramic substrates, PCB boards, powder coating, 3D-MID, photovoltaic, and other industries.
The Plating Is Dense And Smooth
The Plating Solution Is Reliable Over The Long Term
Multi-industry Universal
Imported Alternative
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.
