SG-100 Pulse Copper Plating Process for TGV Applications

Product Introduction

• Excellent filling capability for both Through-Holes (TH) and Blind Vias (BVH).
• High-volume production (HVM) for core materials ranging from 50-300um.
• Reduces production costs and improves yield rates.
• High-reliability thermal shock performance.
• Thermal conductivity is 50 times higher than epoxy resin plug-hole solutions.
• Ideal for Wafers, Ceramic Substrates, IC Substrates, TV, and TSV applications.

Cost Reduction and Efficiency Improvement

Reliable Thermal Shock Resistance

Wide Range of Applications

Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.