Electroplating Nickel
NI-2006HSX Low-Stress Nickel Plating Additive
Produces semi-bright nickel deposits with low internal stress and excellent
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Product Introduction
- NI-2006HSX is a Nickel Sulfamate-based plating process.
- Produces semi-bright nickel deposits with low internal stress and excellent
- ductility.
- Particularly suitable as an underlayer for precious and non-precious metal plating.
- Engineered for high-speed plating equipment using both soluble and insoluble anode systems.
- Ensures exceptional crystal structure within a current density range of 5-50 ASD.
- Primarily used in the manufacturing of PCBs, connectors, semiconductors, and other high-reliability electronic components.
High current density range
Multi-industry universal
Imported alternative
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.