NIHP-2302 High-Phosphorus Electroless Nickel Plating Additive

Product Introduction

• Stable High-Phosphorus Deposit: Produces an alloy coating with a precise Phosphorus (P) content of 10-12%, ensuring superior chemical resistance and non-magnetic properties.
• Consistent Deposition Rate: Maintains a reliable plating speed of 6-12 um/h throughout the entire bath life, ensuring predictable production schedules.
• Full Environmental Compliance: Lead-free and Cadmium-free （Pb-free/Cd-free）formulation, fully compliant with international ELV, RoHS, and WEEE directives.
• Robust Operating Window: Features high stability and a broad operating range, making it user-friendly and easy to maintain even in complex production environments.
• Advanced Formulation: Free from EDTA and Boric Acid; exhibits high tolerance to metallic impurities, reducing the risk of bath decomposition.
• Exceptional Bath Longevity: Equipped with a unique stabilizer system that extends the service life up to 6 MTO (Metal Turn Overs).
• Versatile Application: Perfectly suited for both Rack and Barrel plating configurations.

Barrel Plating Applicable

Rack Plating Applicable

High Stability

Imported Alternative

Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.