Electroless Nickel
NIPF-1504 Nickel-Coated Copper (Ni/Cu) Additive (Phosphorus-Free)
High-temperature resistance with superior solderability and thermal bonding strength on copper.
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Product Introduction
- Produces a semi-bright and uniform nickel alloy deposit.
- Low internal stress within the deposit.
- High-temperature resistance with superior solderability and thermal bonding strength on copper.
- High hardness for enhanced wear resistance.
- Low-temperature operation with high tolerance to metal contamination, significantly extending bath life.
- • Versatile application: Suitable for coating copper powder, graphite powder, aluminum powder, and other metal surfaces.
Semi-bright, Uniform Plating
High Hardness Wear Resistance
Imported Alternative
Compliance: The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.
