Powder Electroless Plating Technology
P-08 CU-011 Copper Surface Protectant for Powders
Powder-grade protectant preventing oxidation of copper powders during storage and processing.
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Overview
Powder-grade protectant preventing oxidation of copper powders during storage and processing.
Part of our Powder Electroless Plating Technology portfolio. Contact our engineering team for detailed process specifications, TDS documents and sample availability.